公开(公告)号：US09013890B2

公开(公告)日：2015-04-21

申请号：US13348531

申请日：2012-01-11

Applicant: Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

Inventor： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

IPC: H05K7/00 ,  G01R15/20 ,  G01R33/07 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00

CPC classification number: G01R15/20 ,  G01R15/207 ,  G01R33/072 ,  H01L23/047 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32111 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49177 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

Abstract translation: 在一个实施例中，半导体封装包括具有形成内膜部分和外缘部分的凹部的隔离容器。 边缘部分比膜部分厚。 封装包括设置在凹部中的半导体芯片和设置在隔离容器的膜部下方的背板。

公开(公告)号：US08071433B2

公开(公告)日：2011-12-06

申请号：US12868422

申请日：2010-08-25

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/00 ,  H01L21/337

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US07998797B2

公开(公告)日：2011-08-16

申请号：US12330676

申请日：2008-12-09

Applicant: Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

Inventor： Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

IPC: H01L21/00 ,  H01L23/12

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68386 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

Abstract translation: 组装半导体器件的方法包括提供附接到弹性载体的芯片，并且用加强件支撑弹性载体。 该方法还包括在将弹性载体附接到板上之后从弹性载体移除加强件。

公开(公告)号：US07688592B2

公开(公告)日：2010-03-30

申请号：US10598285

申请日：2005-02-22

Applicant: Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

Inventor： Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC classification number: H01L23/4093 ,  F28F2280/10 ,  H01L23/36 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.

Abstract translation: 公开了一种用于具有功率半导体的器件的冷却系统和用于冷却器件的方法。 在一个实施例中，冷却系统具有布置在插入式接触条中的电路载体上的印刷电路板。 冷却系统本身具有冷却板，该冷却板以可枢转的方式安装在功率半导体部件的区域中的一个插入式接触片上。 冷却板可以围绕轴线枢转，使得其呈现离开印刷电路板的第一位置，第二位置和冷却板承载在功率半导体部件上的第二位置。

公开(公告)号：US20070262433A1

公开(公告)日：2007-11-15

申请号：US11748135

申请日：2007-05-14

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US07235873B2

公开(公告)日：2007-06-26

申请号：US10210218

申请日：2002-08-01

Applicant: Volker Strutz ,  Uta Gebauer

Inventor： Volker Strutz ,  Uta Gebauer

IPC: H01L23/02 ,  H01L23/28 ,  H01L23/29 ,  H01L21/00 ,  H01L21/66

CPC classification number: H01L21/54 ,  H01L23/24 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.

Abstract translation: 用于具有衬底和至少一个待保护部件的子组件的保护装置设置在衬底上，包括用于覆盖子组件的至少一个覆盖元件。 膨胀的填充材料在基材和覆盖元件之间填充至少一个给定的空间，并提供防止机械压缩的保护。 还提供了一种制造保护装置的方法。 将可膨胀材料施加到基底上，并在覆盖元件安装之后进行扩张。

公开(公告)号：US08969985B2

公开(公告)日：2015-03-03

申请号：US13221607

申请日：2011-08-30

Applicant: Volker Strutz ,  Stefan Landau ,  Udo Ausserlechner

Inventor： Volker Strutz ,  Stefan Landau ,  Udo Ausserlechner

IPC: H01L27/22 ,  H01L23/04 ,  H01L23/48 ,  H01L25/16 ,  H01L43/04 ,  G01R33/07 ,  G01R33/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/04 ,  G01R33/0047 ,  G01R33/07 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L43/04 ,  H01L2224/04105 ,  H01L2924/1301 ,  H01L2924/00

Abstract: A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.

Abstract translation: 公开了半导体芯片封装和半导体芯片封装的制造方法。 本发明的实施例包括基板和设置在基板上并由包装材料横向包围的半导体芯片。 封装还包括邻近半导体芯片的电流导轨，通过隔离层与半导体芯片隔离的电流导轨，第一外部焊盘和接触当前导轨与第一外部焊盘的通孔接触。

公开(公告)号：US20070285895A1

公开(公告)日：2007-12-13

申请号：US10598285

申请日：2005-02-22

Applicant: Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

Inventor： Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  F28F2280/10 ,  H01L23/36 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.

Abstract translation: 公开了一种用于具有功率半导体的器件的冷却系统和用于冷却器件的方法。 在一个实施例中，冷却系统具有布置在插入式接触条中的电路载体上的印刷电路板。 冷却系统本身具有冷却板，该冷却板以可枢转的方式安装在功率半导体部件的区域中的一个插入式接触片上。 冷却板可以围绕轴线枢转，使得其呈现离开印刷电路板的第一位置，第二位置和冷却板承载在功率半导体部件上的第二位置。

公开(公告)号：US20130049746A1

公开(公告)日：2013-02-28

申请号：US13221607

申请日：2011-08-30

Applicant: Volker Strutz ,  Stefan Landau ,  Udo Ausserlechner

Inventor： Volker Strutz ,  Stefan Landau ,  Udo Ausserlechner

IPC: G01R33/07 ,  H01L29/82 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/04 ,  G01R33/0047 ,  G01R33/07 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L43/04 ,  H01L2224/04105 ,  H01L2924/1301 ,  H01L2924/00

Abstract: A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.

Abstract translation: 公开了半导体芯片封装和半导体芯片封装的制造方法。 本发明的实施例包括基板和设置在基板上并由包装材料横向包围的半导体芯片。 封装还包括邻近半导体芯片的电流导轨，通过隔离层与半导体芯片隔离的电流导轨，第一外部焊盘和接触当前导轨与第一外部焊盘的通孔接触。

公开(公告)号：US20100323479A1

公开(公告)日：2010-12-23

申请号：US12868422

申请日：2010-08-25

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/56

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。