Invention Grant
- Patent Title: Device and method for liquid treatment of wafer-shaped articles
- Patent Title (中): 晶片状物品的液体处理装置及方法
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Application No.: US11915352Application Date: 2006-05-18
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Publication No.: US08029641B2Publication Date: 2011-10-04
- Inventor: Andreas Baldy , Markus Gacher , Michael Brugger
- Applicant: Andreas Baldy , Markus Gacher , Michael Brugger
- Applicant Address: AT Villach
- Assignee: Lam Research AG
- Current Assignee: Lam Research AG
- Current Assignee Address: AT Villach
- Agency: Young & Thompson
- Priority: ATA905/2005 20050525
- International Application: PCT/EP2006/062412 WO 20060518
- International Announcement: WO2006/125744 WO 20061130
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B08B3/04 ; B05C13/00
Abstract:
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispensing members for dispensing liquid onto the first surface plane W1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of the liquid around the edge surface of the wafer-shaped article towards the second surface plane W2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein the liquid guiding member has the form of a ring.
Public/Granted literature
- US20080196835A1 Device and Method For Liquid Treatment of Wafer-Shaped Articles Public/Granted day:2008-08-21
Information query
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