Invention Grant
- Patent Title: Integrating a first contact structure in a gate last process
- Patent Title (中): 在最后一个进程中集成第一个接触结构
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Application No.: US12341891Application Date: 2008-12-22
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Publication No.: US08035165B2Publication Date: 2011-10-11
- Inventor: Chiung-Han Yeh , Ming-Yuan Wu , Kong-Beng Thei , Harry Chuang , Mong-Song Liang
- Applicant: Chiung-Han Yeh , Ming-Yuan Wu , Kong-Beng Thei , Harry Chuang , Mong-Song Liang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device is provided which includes a semiconductor substrate, a transistor formed on the substrate, the transistor having a gate stack including a metal gate and high-k gate dielectric and a dual first contact formed on the substrate. The dual first contact includes a first contact feature, a second contact feature overlying the first contact feature, and a metal barrier formed on sidewalls and bottom of the second contact feature, the metal barrier layer coupling the first contact feature to the second contact feature.
Public/Granted literature
- US20100052075A1 INTEGRATING A FIRST CONTACT STRUCTURE IN A GATE LAST PROCESS Public/Granted day:2010-03-04
Information query
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