Invention Grant
US08035165B2 Integrating a first contact structure in a gate last process 有权
在最后一个进程中集成第一个接触结构

Integrating a first contact structure in a gate last process
Abstract:
A semiconductor device is provided which includes a semiconductor substrate, a transistor formed on the substrate, the transistor having a gate stack including a metal gate and high-k gate dielectric and a dual first contact formed on the substrate. The dual first contact includes a first contact feature, a second contact feature overlying the first contact feature, and a metal barrier formed on sidewalls and bottom of the second contact feature, the metal barrier layer coupling the first contact feature to the second contact feature.
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