Invention Grant
- Patent Title: Adhesion-enhanced polyimide film, process for its production, and laminated body
- Patent Title (中): 粘合增强聚酰亚胺膜，其生产方法和层压体
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Application No.: US10591749Application Date: 2005-03-02
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Publication No.: US08053082B2Publication Date: 2011-11-08
- Inventor: Masafumi Hashimoto , Takeshi Uekido , Toshiyuki Nishino , Toshihiko Anno
- Applicant: Masafumi Hashimoto , Takeshi Uekido , Toshiyuki Nishino , Toshihiko Anno
- Applicant Address: JP
- Assignee: Ube Industries, Ltd.
- Current Assignee: Ube Industries, Ltd.
- Current Assignee Address: JP
- Agency: DLA Piper LLP (US)
- Priority: JP2004-084836 20040323
- International Application: PCT/JP2005/004014 WO 20050302
- International Announcement: WO2005/090069 WO 20050929
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B27/00 ; B05D3/02
Abstract:
An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).
Public/Granted literature
- US20070196675A1 Adhesion-Enhanced Polyimide Film, Process for Its Production, And Laminated Body Public/Granted day:2007-08-23
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