Invention Grant
US08070048B2 Method of attaching a solder ball and method of repairing a memory module
有权
连接焊球的方法和修复存储器模块的方法
- Patent Title: Method of attaching a solder ball and method of repairing a memory module
- Patent Title (中): 连接焊球的方法和修复存储器模块的方法
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Application No.: US12881439Application Date: 2010-09-14
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Publication No.: US08070048B2Publication Date: 2011-12-06
- Inventor: Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
- Applicant: Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR2009-90006 20090923
- Main IPC: B23K1/00
- IPC: B23K1/00
Abstract:
In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.
Public/Granted literature
- US20110068151A1 METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY MODULE Public/Granted day:2011-03-24
Information query
IPC分类:
