Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12251397Application Date: 2008-10-14
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Publication No.: US08076585B2Publication Date: 2011-12-13
- Inventor: Yu-Hsu Lin
- Applicant: Yu-Hsu Lin
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810301797 20080527
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid.
Public/Granted literature
- US20090294152A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-12-03
Information query
