Invention Grant
- Patent Title: Die-warpage compensation structures for thinned-die devices, and methods of assembling same
- Patent Title (中): 薄型模具装置的模翘曲补偿结构及其组装方法
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Application No.: US12456638Application Date: 2009-06-18
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Publication No.: US08080870B2Publication Date: 2011-12-20
- Inventor: Chuan Hu
- Applicant: Chuan Hu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10
Abstract:
A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is disposed on the active side of the microelectronic die.
Public/Granted literature
- US20100320576A1 Die-warpage compensation structures for thinned-die devices, and methods of assembling same Public/Granted day:2010-12-23
Information query
IPC分类:
