Invention Grant
US08081484B2 Method and apparatus for supporting a computer chip on a printed circuit board assembly
有权
用于在印刷电路板组件上支撑计算机芯片的方法和装置
- Patent Title: Method and apparatus for supporting a computer chip on a printed circuit board assembly
- Patent Title (中): 用于在印刷电路板组件上支撑计算机芯片的方法和装置
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Application No.: US11606750Application Date: 2006-11-30
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Publication No.: US08081484B2Publication Date: 2011-12-20
- Inventor: Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
- Applicant: Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: BainwoodHuang
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
Public/Granted literature
- US20080130241A1 Method and apparatus for supporting a computer chip on a printed circuit board assembly Public/Granted day:2008-06-05
Information query
