Invention Grant
- Patent Title: Heat treatment method
- Patent Title (中): 热处理方法
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Application No.: US12950203Application Date: 2010-11-19
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Publication No.: US08088448B2Publication Date: 2012-01-03
- Inventor: Takahiro Asai , Koichi Misumi , Hirofumi Imai
- Applicant: Takahiro Asai , Koichi Misumi , Hirofumi Imai
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-158391 20080617; JP2009-074898 20090325
- Main IPC: B05D3/02
- IPC: B05D3/02
Abstract:
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
Public/Granted literature
- US20110061800A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD Public/Granted day:2011-03-17
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