Invention Grant
- Patent Title: Film forming method and electrooptic apparatus
- Patent Title (中): 成膜方法和电光装置
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Application No.: US12212040Application Date: 2008-09-17
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Publication No.: US08097294B2Publication Date: 2012-01-17
- Inventor: Katsumi Suzuki
- Applicant: Katsumi Suzuki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2007-281394 20071030
- Main IPC: B05D5/06
- IPC: B05D5/06 ; B05D3/02

Abstract:
A method for forming a film by applying a material liquid to an application area of a base material and drying the applied material liquid includes: (a) forming a frame-shaped partition in the application area, the partition having a side surface facing a center of the application area; (b) applying the material liquid to the application area; and (c) drying the material liquid. In step (a), the partition is formed so that the side surface of the partition is closer to the center than an outer edge of the application area and so that a height of the partition is smaller than a film thickness of the material liquid at a time when the material liquid is applied and is larger than a thickness of the dried film.
Public/Granted literature
- US20090110868A1 FILM FORMING METHOD AND ELECTROOPTIC APPARATUS Public/Granted day:2009-04-30
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