Invention Grant
US08110244B2 Manufacturing method and apparatus of organic resin coated metal sheet
有权
有机树脂涂层金属板的制造方法和装置
- Patent Title: Manufacturing method and apparatus of organic resin coated metal sheet
- Patent Title (中): 有机树脂涂层金属板的制造方法和装置
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Application No.: US12306025Application Date: 2007-06-18
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Publication No.: US08110244B2Publication Date: 2012-02-07
- Inventor: Takuji Nakamura , Hiroshi Inazawa , Norimasa Maida , Yasuhiro Matsubara
- Applicant: Takuji Nakamura , Hiroshi Inazawa , Norimasa Maida , Yasuhiro Matsubara
- Applicant Address: JP Tokyo
- Assignee: Toyo Kohan Co., Ltd.
- Current Assignee: Toyo Kohan Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Browdy and Neimark, PLLC
- Priority: JP2006-169597 20060620
- International Application: PCT/JP2007/062206 WO 20070618
- International Announcement: WO2007/148641 WO 20071227
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B05D3/06 ; B05D3/12

Abstract:
A manufacturing method and apparatus of an organic resin coated metal sheet is provided. Temperatures of edge portions of the metal sheet and a temperature of an approximately central portion of the metal sheet are respectively measured using a metal-sheet temperature measuring device arranged directly upstream of lamination rolls. Respectively measured temperature values are inputted to a heating temperature controller, and output values calculated by the heating temperature controllers are inputted to a metal sheet center portion heater and the metal sheet center portion heater, respectively, to control the heating of a widthwise approximately center portion and edge portion, respectively, to a first and second temperature, respectively, the second temperature being higher than the first. A resin film is extruded to pre-rolls and is sandwiched and pressure-bonding to the metal sheet between a pair of lamination rolls. Resin portions projecting from both edge portions are then removed.
Public/Granted literature
- US20090283200A1 MANUFACTURING METHOD AND APPARATUS OF ORGANIC RESIN COATED METAL SHEET Public/Granted day:2009-11-19
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