Invention Grant
US08120086B2 Low leakage capacitors including portions in inter-layer dielectrics
有权
低漏电容器,包括层间电介质中的部分
- Patent Title: Low leakage capacitors including portions in inter-layer dielectrics
- Patent Title (中): 低漏电容器,包括层间电介质中的部分
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Application No.: US12331109Application Date: 2008-12-09
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Publication No.: US08120086B2Publication Date: 2012-02-21
- Inventor: Oscar M. K. Law , Kong-Beng Thei , Harry Chuang
- Applicant: Oscar M. K. Law , Kong-Beng Thei , Harry Chuang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94

Abstract:
An integrated circuit structure includes a semiconductor substrate including a first region and a second region; an insulation region in the second region of the semiconductor substrate; and an inter-layer dielectric (ILD) over the insulation region. A transistor is in the first region. The transistor includes a gate dielectric and a gate electrode over the gate dielectric. A first conductive line and a second conductive line are over the insulation region. The first conductive line and the second conductive line are substantially parallel to each other and extending in a first direction. A first metal line and a second metal line are in a bottom metal layer (M1) and extending in the first direction. The first metal line and the second metal line substantially vertically overlap the first conductive line and the second conductive line, respectively. The first metal line and the second metal line form two capacitor electrodes of a capacitor.
Public/Granted literature
- US20100078695A1 Low Leakage Capacitors Including Portions in Inter-Layer Dielectrics Public/Granted day:2010-04-01
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