Invention Grant
- Patent Title: Method for manufacturing a microelectromechanical component, and a microelectromechanical component
- Patent Title (中): 微机电部件的制造方法以及微机电部件
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Application No.: US12292435Application Date: 2008-11-19
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Publication No.: US08124435B2Publication Date: 2012-02-28
- Inventor: Heikki Kuisma
- Applicant: Heikki Kuisma
- Applicant Address: FI Vantaa
- Assignee: VTI Technologies Oy
- Current Assignee: VTI Technologies Oy
- Current Assignee Address: FI Vantaa
- Agency: Squire Sanders (US) LLP
- Priority: FI20055618 20051123
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L29/84

Abstract:
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.
Public/Granted literature
- US20090137079A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component Public/Granted day:2009-05-28
Information query
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