公开(公告)号：US08450816B2

公开(公告)日：2013-05-28

申请号：US13357088

申请日：2012-01-24

Applicant: Heikki Kuisma

Inventor： Heikki Kuisma

IPC: H01L29/82 ,  H01L29/84 ,  H01L23/12 ,  H01L23/48

CPC classification number: G01C19/56 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2203/0792 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

Abstract translation: 本发明涉及微电子机械部件，如用于测量的微机电量规。 加速度，角加速度，角速度或其他物理量。 根据本发明的微电子机械部件包括通过盖部件密封的微机电芯片部件和适当地彼此粘合的电子电路部件。 本发明的目的是提供一种制造微机电部件的改进方法，并且提供一种适用于特别是在小型微机电传感器解决方案中的微机电部件。

公开(公告)号：US20120280758A1

公开(公告)日：2012-11-08

申请号：US13508997

申请日：2010-11-19

Applicant: Antti Jaakkola ,  Heikki Kuisma

Inventor： Antti Jaakkola ,  Heikki Kuisma

IPC: H03B5/30 ,  H05K13/00

CPC classification number: H01P11/008 ,  H01P7/082 ,  H03H3/0076 ,  H03H9/172 ,  H03H9/2436 ,  H03H2009/0233 ,  H03H2009/241 ,  H03H2009/2442

Abstract: The invention concerns a novel bulk acoustic wave (BAW) resonator design and method of manufacturing thereof The bulk acoustic wave resonator comprises a resonator portion, which is provided with at least one void having the form of a trench which forms a continuous closed path on the resonator portion. By manufacturing the void in the same processing step as the outer dimensions of the resonator portion, the effect of processing variations on the resonant frequency of the resonator can be reduced. By means of the invention, the accuracy of BAW resonators can be increased.

Abstract translation: 本发明涉及一种新颖的体声波（BAW）谐振器设计及其制造方法。本体声波谐振器包括谐振器部分，该谐振器部分设置有至少一个具有沟槽形式的空隙，该空隙形成在 谐振器部分。 通过在与谐振器部分的外部尺寸相同的处理步骤中制造空隙，可以减小对谐振器的谐振频率的处理变化的影响。 通过本发明，可以提高BAW谐振器的精度。

公开(公告)号：US5083234A

公开(公告)日：1992-01-21

申请号：US553597

申请日：1990-07-18

Applicant: Ari Lehto ,  Juha Lahdenpera ,  Heikki Kuisma

Inventor： Ari Lehto ,  Juha Lahdenpera ,  Heikki Kuisma

IPC: H01L23/52 ,  G01L9/00 ,  G01L9/12 ,  H01L21/3205 ,  H01L21/78 ,  H01L29/41

CPC classification number: G01L9/0042 ,  H01L21/78 ,  H01L2924/0002 ,  Y10T29/435

Abstract: In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or another suitable metallization method. By virtue of the fabrication method of the contact areas, the size of the transducer (1')can be reduced and the transducer (1') can be bonded to a circuit board using surface-mount technology.

Abstract translation: 在具有接合触点的新型多层传感器（1'）和用于制造换能器的接合接触区域（5'）的方法中，接触区域（5'）通过金属在换能器的侧表面（7）上形成 使用基于激光的沉积，溅射沉积或其它合适的金属化方法的沉积。 通过接触区域的制造方法，可以减小换能器（1'）的尺寸，并且可以使用表面贴装技术将换能器（1'）接合到电路板。

公开(公告)号：US4378168A

公开(公告)日：1983-03-29

申请号：US238563

申请日：1981-02-26

Applicant: Heikki Kuisma ,  Tapio Wiik

Inventor： Heikki Kuisma ,  Tapio Wiik

IPC: G01N29/00 ,  G01N25/66 ,  G01N25/68

CPC classification number: G01N25/66 ,  G01N2291/02845 ,  G01N2291/02881

Abstract: A piezoelectric sensor consists of material for transmitting elastic waves and has a surface subjected to the condensation and presence of dew and liquid to be detected. A wave producing device includes a transmitter for producing an acoustic surface wave on the surface in conjunction with piezoelectric phenomena of the sensor. A detector includes a receiver for receiving the wave after transmission thereof across the surface. The wave is variably attenuated in transmission between the transmitter and receiver in accordance with dew or liquid on the surface. A measuring device measures the attenuation of the detected wave and thereby indicates the dew point or presence of liquid on the surface.

Abstract translation: 压电传感器由用于传输弹性波的材料组成，并且具有经受冷凝的表面和待检测的露水和液体的存在。 波形产生装置包括与传感器的压电现象一起在表面上产生声表面波的发射器。 检测器包括用于在通过表面传输波之后接收波的接收器。 根据表面上的露水或液体，波在发射机和接收机之间的传输中可变地衰减。 测量装置测量检测到的波的衰减，从而指示表面上的露点或液体存在。

公开(公告)号：US20140217615A1

公开(公告)日：2014-08-07

申请号：US14127580

申请日：2012-06-29

Applicant: Heikki Kuisma

Inventor： Heikki Kuisma

IPC: H01L23/528 ,  H01L23/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/036 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  G01C19/5783 ,  G01L19/0084 ,  G01L19/148 ,  G01P1/023 ,  G01P1/026 ,  G01P15/0802 ,  H01L21/568 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14618 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8312 ,  H01L2224/8319 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract translation: 公开了一种制造系统级封装器件的方法，以及一种系统级封装器件。 在该方法中，具有预定尺寸的至少一个第一种类模具，具有预定尺寸的至少一种第二种类模具，并且系统级装置中的至少一个其它部件包括在系统级封装装置中。 选择第一和第二种类模具中的至少一种用于重新定向，并且将材料添加到所选择的模具的至少一侧，使得添加的材料和所选择的模具形成重新定型的模具结构。 在重新定型的模具结构上形成连接层。 尺寸设计为重新定型的模具结构，以允许非选择的模具和至少一个另外的部件通过连接层与重新定向的模具结构接触。

公开(公告)号：US07302857B2

公开(公告)日：2007-12-04

申请号：US10503089

申请日：2003-02-10

Applicant: Heikki Kuisma ,  Juha Lahdenperä ,  Risto Mutikainen

Inventor： Heikki Kuisma ,  Juha Lahdenperä ,  Risto Mutikainen

IPC: G01B7/16 ,  G01L1/00

CPC classification number: G01L19/04 ,  G01L9/0073 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/084

Abstract: A method of manufacturing a sensor including forming an insulating layer on top of a conductive substrate, and forming a conducting electrode on top of the insulating layer. Further, the insulating layer is formed to include support areas formed at edges of the conducting electrode and a partial area formed under the conducting electrode, and a thickness (d2) of the partial area of the insulating layer is less than a thickness (d1) of the support areas of the insulating area.

Abstract translation: 一种传感器的制造方法，包括在导电性基板的顶部形成绝缘层，在绝缘层的顶部形成导电性电极。 此外，绝缘层形成为包括形成在导电电极的边缘处的支撑区域和形成在导电电极下方的部分区域，并且绝缘层的局部区域的厚度（d 2）小于厚度（d 1）绝缘区域的支撑区域。

公开(公告)号：US06998059B2

公开(公告)日：2006-02-14

申请号：US10472465

申请日：2002-03-21

Applicant: Heikki Kuisma ,  Juha Lahdenperä ,  Risto Mutikainen

Inventor： Heikki Kuisma ,  Juha Lahdenperä ,  Risto Mutikainen

IPC: C23F1/00

CPC classification number: B81C1/00182 ,  B81B2201/0235 ,  B81C2201/0132 ,  B81C2201/0133 ,  G01P15/0802 ,  G01P2015/0817

Abstract: The invention relates to a method for manufacturing a silicon sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched opening at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring element configuration (7). According to the invention, the openings and trenches (8) extending through the depth of the silicon wafer are fabricated by dry etch methods, and the etch process used for controlling the spring constant of the spring element configuration (7) is based on wet etch methods.

Abstract translation: 本发明涉及一种硅传感器结构和硅传感器的制造方法。 根据该方法，通过蚀刻开口形成单晶硅晶片（10），至少一个弹簧元件构造（7）和连接到所述弹簧元件构型（7）的至少一个地震块（8）。 根据本发明，通过干蚀刻方法制造延伸穿过硅晶片深度的开口和沟槽（8），并且用于控制弹簧元件构型（7）的弹簧常数的蚀刻工艺基于湿蚀刻 方法。

公开(公告)号：US20050105245A1

公开(公告)日：2005-05-19

申请号：US10503089

申请日：2003-02-10

Applicant: Heikki Kuisma ,  Juha Lahdenpera ,  Risto Mutikainen

Inventor： Heikki Kuisma ,  Juha Lahdenpera ,  Risto Mutikainen

IPC: G01L9/00 ,  G01L19/04 ,  G01P15/08 ,  G01P15/125 ,  H01G4/06

CPC classification number: G01L19/04 ,  G01L9/0073 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/084

Abstract: This publication discloses a method for creating a sensor construction. According to the method, on top of a conducting substrate (2), an insulating layer (5) is formed and connected to the micromechanical construction. According to the invention, the insulating layer (5) is formed to be thicker (14) in the support area (16) than in the other areas, or thinner (13) in the area of the electrode (8) than in the support area (16) of the sensor.

Abstract translation: 该出版物公开了一种用于创建传感器结构的方法。 根据该方法，在导电基板（2）的顶部形成绝缘层（5）并与微机械结构连接。 根据本发明，绝缘层（5）形成为在支撑区域（16）中比在电极（8）的区域中的其他区域或更薄（13）中的厚度大于支撑区域（16）中的厚度（14） 传感器的区域（16）。

公开(公告)号：US08124435B2

公开(公告)日：2012-02-28

申请号：US12292435

申请日：2008-11-19

Applicant: Heikki Kuisma

Inventor： Heikki Kuisma

IPC: H01L21/00 ,  H01L23/495 ,  H01L29/84

CPC classification number: G01C19/56 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2203/0792 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

Abstract translation: 本发明涉及微电子机械部件，如用于测量的微机电量规。 加速度，角加速度，角速度或其他物理量。 根据本发明的微电子机械部件包括通过盖部件密封的微机电芯片部件和适当地彼此粘合的电子电路部件。 本发明的目的是提供一种制造微机电部件的改进方法，并且提供一种适用于特别是在小型微机电传感器解决方案中的微机电部件。

公开(公告)号：US20070132047A1

公开(公告)日：2007-06-14

申请号：US11603070

申请日：2006-11-22

Applicant: Heikki Kuisma ,  Jiri Niemisto

Inventor： Heikki Kuisma ,  Jiri Niemisto

IPC: H01L29/84

CPC classification number: B81C1/0023 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C2203/0792 ,  G01C19/56 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

Abstract translation: 本发明涉及微电子机械部件，如用于测量的微机电量规。 加速度，角加速度，角速度或其他物理量。 根据本发明的微电子机械部件包括彼此适当地接合由盖部分密封的微机电芯片部分和至少一个电子电路部件。 本发明的目的是提供一种制造微机电部件的改进方法，并且提供一种适用于特别是在小型微机电传感器解决方案中的微机电部件。