Invention Grant
- Patent Title: Stacking multiple devices using single-piece interconnecting element
- Patent Title (中): 使用单件互连元件堆叠多个设备
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Application No.: US12844795Application Date: 2010-07-27
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Publication No.: US08124450B2Publication Date: 2012-02-28
- Inventor: Phan Hoang , Chinh Nguyen , Anthony Tran , Tung Dang
- Applicant: Phan Hoang , Chinh Nguyen , Anthony Tran , Tung Dang
- Applicant Address: US CA Rancho Santa Margarita
- Assignee: Virtium Technology, Inc.
- Current Assignee: Virtium Technology, Inc.
- Current Assignee Address: US CA Rancho Santa Margarita
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.
Public/Granted literature
- US20100291736A1 STACKING MULTIPLE DEVICES USING SINGLE-PIECE INTERCONNECTING ELEMENT Public/Granted day:2010-11-18
Information query
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