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US08138495B2 Film stress management for MEMS through selective relaxation 有权
通过选择性放松对MEMS的薄膜应力管理

Film stress management for MEMS through selective relaxation
Abstract:
An apparatus comprising a microelectromechanical system. The microelectromechanical system includes a crystalline structural element having dislocations therein. For at least about 60 percent of adjacent pairs of the dislocations, direction vectors of the dislocations form acute angles of less than about 45 degrees.
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