Invention Grant
- Patent Title: Polishing composition
- Patent Title (中): 抛光组成
-
Application No.: US12225374Application Date: 2007-03-19
-
Publication No.: US08147712B2Publication Date: 2012-04-03
- Inventor: Akinori Etoh , Setsuko Oike , Shigeharu Fujii , Kiyotaka Shindo , Tomokazu Ishizuka
- Applicant: Akinori Etoh , Setsuko Oike , Shigeharu Fujii , Kiyotaka Shindo , Tomokazu Ishizuka
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2006-076071 20060320
- International Application: PCT/JP2007/000249 WO 20070319
- International Announcement: WO2007/108215 WO 20070927
- Main IPC: C09K13/00
- IPC: C09K13/00
Abstract:
Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.
Public/Granted literature
- US20100155654A1 Polishing Composition Public/Granted day:2010-06-24
Information query
