公开(公告)号：US20120309170A1

公开(公告)日：2012-12-06

申请号：US13576786

申请日：2011-09-28

Applicant: Eiji Hayashishita ,  Katsutoshi Ozaki ,  Mitsuru Sakai ,  Setsuko Oike

Inventor： Eiji Hayashishita ,  Katsutoshi Ozaki ,  Mitsuru Sakai ,  Setsuko Oike

IPC: H01L21/78 ,  C08L23/20 ,  C08L23/14 ,  C09J7/02

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2405/00 ,  B32B2457/14 ,  C08J5/18 ,  C08J2323/16 ,  C08J2323/20 ,  C09J7/241 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2423/006 ,  Y10T156/1052 ,  Y10T428/24942 ,  Y10T428/28

Abstract: To provide an olefinic expandable substrate and a dicing film that exhibits less contamination characteristics, high expandability without necking, which cannot be achieved by conventional olefinic expandable substrates. In order to achieve the object, an expandable film comprises a 1-butene-α-olefin copolymer (A) having a tensile modulus at 23° C. of 100 to 500 MPa and a propylenic elastomer composition (B) comprising a propylene-α-olefin copolymer (b1) and having a tensile modulus at 23° C. of 10 to 50 MPa, wherein the amount of the component (B) is 30 to 70 weight parts relative to 100 weight parts in total of components (A) and (B).

Abstract translation: 提供通过常规的烯烃可发性基材不能实现的烯烃发泡基材和显影剂污染特性较小，无颈缩的高扩展性的切割薄膜。 为了实现该目的，可发性膜包含在23℃下的拉伸弹性模量为100-500MPa的1-丁烯-α-烯烃共聚物（A）和包含丙烯-α-丙烯的丙烯类弹性体组合物（B） α-烯烃共聚物（b1），并且在23℃下的拉伸弹性模量为10〜50MPa，其中组分（B）的量相对于组分（A）和（A）的总重量相对于100重量份为30〜70重量份 （B）。

公开(公告)号：US08728910B2

公开(公告)日：2014-05-20

申请号：US13576786

申请日：2011-09-28

Applicant: Eiji Hayashishita ,  Katsutoshi Ozaki ,  Mitsuru Sakai ,  Setsuko Oike

Inventor： Eiji Hayashishita ,  Katsutoshi Ozaki ,  Mitsuru Sakai ,  Setsuko Oike

IPC: H01L21/30 ,  H01L21/46

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2405/00 ,  B32B2457/14 ,  C08J5/18 ,  C08J2323/16 ,  C08J2323/20 ,  C09J7/241 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2423/006 ,  Y10T156/1052 ,  Y10T428/24942 ,  Y10T428/28

Abstract: To provide an olefinic expandable substrate and a dicing film that exhibits less contamination characteristics, high expandability without necking, which cannot be achieved by conventional olefinic expandable substrates. In order to achieve the object, an expandable film comprises a 1-butene-α-olefin copolymer (A) having a tensile modulus at 23° C. of 100 to 500 MPa and a propylenic elastomer composition (B) comprising a propylene-α-olefin copolymer (b1) and having a tensile modulus at 23° C. of 10 to 50 MPa, wherein the amount of the component (B) is 30 to 70 weight parts relative to 100 weight parts in total of components (A) and (B).

Abstract translation: 提供通过常规的烯烃可发性基材不能实现的烯烃发泡基材和显影剂污染特性较小，无颈缩的高扩展性的切割薄膜。 为了实现该目的，可发性膜包含在23℃下的拉伸弹性模量为100-500MPa的1-丁烯-α-烯烃共聚物（A）和包含丙烯-α-丙烯的丙烯类弹性体组合物（B） α-烯烃共聚物（b1），并且在23℃下的拉伸弹性模量为10〜50MPa，其中组分（B）的量相对于组分（A）和（A）的总重量相对于100重量份为30〜70重量份 （B）。

公开(公告)号：US20090064597A1

公开(公告)日：2009-03-12

申请号：US11918226

申请日：2006-04-14

Applicant: Akinori Etoh ,  Setsuko Oike ,  Tomokazu Ishizuka ,  Shigeharu Fujii ,  Kiyotaka Shindo

Inventor： Akinori Etoh ,  Setsuko Oike ,  Tomokazu Ishizuka ,  Shigeharu Fujii ,  Kiyotaka Shindo

IPC: C09G1/02

CPC classification number: C09G1/02 ,  C09K3/1409 ,  C09K3/1454 ,  H01L21/3212

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract translation: 公开了一种抛光浆料，其能够在确保足够的抛光速率的同时抑制对底层的损伤。 研磨浆料含有具有酰胺基的树脂（A）和有机树脂（B）。

公开(公告)号：US08147712B2

公开(公告)日：2012-04-03

申请号：US12225374

申请日：2007-03-19

Applicant: Akinori Etoh ,  Setsuko Oike ,  Shigeharu Fujii ,  Kiyotaka Shindo ,  Tomokazu Ishizuka

Inventor： Akinori Etoh ,  Setsuko Oike ,  Shigeharu Fujii ,  Kiyotaka Shindo ,  Tomokazu Ishizuka

IPC: C09K13/00

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/32125

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract translation: 公开了一种抛光组合物，该抛光组合物含有不少于1重量％的水溶性树脂，其通过聚合含有氨基和/或酰胺基的乙烯基单体而获得，基于抛光组合物的总重量。

公开(公告)号：US20100155654A1

公开(公告)日：2010-06-24

申请号：US12225374

申请日：2007-03-19

Applicant: Akinori Etoh ,  Setsuko Oike ,  Shigeharu Fujii ,  Kiyotaka Shindo ,  Tomokazu Ishizuka

Inventor： Akinori Etoh ,  Setsuko Oike ,  Shigeharu Fujii ,  Kiyotaka Shindo ,  Tomokazu Ishizuka

IPC: C09K13/00

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/32125

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract translation: 公开了一种抛光组合物，该抛光组合物含有不少于1重量％的水溶性树脂，其通过聚合含有氨基和/或酰胺基的乙烯基单体而获得，基于抛光组合物的总重量。

公开(公告)号：US09013049B2

公开(公告)日：2015-04-21

申请号：US13818202

申请日：2012-06-22

Applicant: Yugo Yamamoto ,  Jun Okabe ,  Setsuko Oike

Inventor： Yugo Yamamoto ,  Jun Okabe ,  Setsuko Oike

IPC: C08L63/00 ,  C08L63/02 ,  H01L21/56 ,  H01L23/29 ,  H01L51/52 ,  H01L51/50 ,  H01L51/56 ,  C08G59/70 ,  C08K5/16

CPC classification number: H01L51/5253 ,  C08G59/70 ,  C08K5/16 ,  C08L63/00 ,  H01L51/5012 ,  H01L51/5246 ,  H01L51/56

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract translation: 提供一种用于密封光学半导体的树脂组合物，该光学半导体是具有良好的固化性和优异的储存稳定性的密封树脂层的原料; 优选为耐候性优异的密封树脂层用原料。 根据本发明的实施方案1的光半导体用表面密封剂包含分子中具有两个以上环氧基的环氧树脂（a）和含有选自由以下组成的组中的至少一种金属离子的金属络合物（b1） Zn，Bi，Ca，Al，Cd，La和Zr，与金属离子形成络合物并且不具有N-H键的叔胺和分子量为17〜200的阴离子配位体， 密封胶的粘度为10〜10000mPa·s，通过E型粘度计在25℃，1.0rpm下测定。

公开(公告)号：US20140131691A1

公开(公告)日：2014-05-15

申请号：US14130699

申请日：2012-07-05

Applicant: Yugo Yamamoto ,  Masatoshi Takagi ,  Shunsuke Fujii ,  Shintaro Maekawa ,  Setsuko Oike

Inventor： Yugo Yamamoto ,  Masatoshi Takagi ,  Shunsuke Fujii ,  Shintaro Maekawa ,  Setsuko Oike

IPC: H01L23/29 ,  H01L51/52 ,  H01L51/50 ,  H01L27/32

CPC classification number: H01L23/293 ,  C08G59/302 ,  C08G59/38 ,  C08G59/42 ,  C08L63/00 ,  H01L27/3237 ,  H01L51/5012 ,  H01L51/524 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H05B33/10 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide a polymerizable resin composition with which the cured product refractive index is high and the viscosity under a high shear stress is a specific viscosity or lower. Provided is an polymerizable epoxy composition comprising (A1) an S-containing epoxy resin represented by a general formula, (A2) an epoxy compound having a softening point of 70° C. or lower, (B) a curing promoter, and (C) a thiol compound having two or more thiol groups per molecule, wherein viscosity at 25° C. and 60 rpm as determined using a B viscometer is between 100 and 15,000 mPa·s.

Abstract translation: 本发明的目的是提供一种可固化产物折射率高的可聚合树脂组合物，并且在高剪切应力下的粘度是比粘度或更低。 本发明提供一种可聚合环氧组合物，其包含（A1）由通式（A2）表示的含S的环氧树脂，软化点为70℃以下的环氧化合物，（B）固化促进剂和（C ）每分子具有两个或更多个硫醇基的硫醇化合物，其中使用B粘度计测定的在25℃和60rpm下的粘度为100至15,000mPa·s。

公开(公告)号：US20130153880A1

公开(公告)日：2013-06-20

申请号：US13818202

申请日：2012-06-22

Applicant: Yugo Yamamoto ,  Jun Okabe ,  Setsuko Oike

Inventor： Yugo Yamamoto ,  Jun Okabe ,  Setsuko Oike

IPC: H01L51/52 ,  H01L51/50 ,  H01L51/56

CPC classification number: H01L51/5253 ,  C08G59/70 ,  C08K5/16 ,  C08L63/00 ,  H01L51/5012 ,  H01L51/5246 ,  H01L51/56

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract translation: 提供一种用于密封光学半导体的树脂组合物，该光学半导体是具有良好的固化性和优异的储存稳定性的密封树脂层的原料; 优选为耐候性优异的密封树脂层用原料。 根据本发明的实施方案1的光半导体用表面密封剂包含分子中具有两个以上环氧基的环氧树脂（a）和含有选自由以下组成的组中的至少一种金属离子的金属络合物（b1） Zn，Bi，Ca，Al，Cd，La和Zr，与金属离子形成络合物并且不具有NH键的叔胺和分子量为17〜200的阴离子配体，表面密封剂 粘度为10〜10000mPa·s，通过E型粘度计在25℃，1.0rpm下测定。

公开(公告)号：US08460414B2

公开(公告)日：2013-06-11

申请号：US11918226

申请日：2006-04-14

Applicant: Akinori Etoh ,  Setsuko Oike ,  Tomokazu Ishizuka ,  Shigeharu Fujii ,  Kiyotaka Shindo

Inventor： Akinori Etoh ,  Setsuko Oike ,  Tomokazu Ishizuka ,  Shigeharu Fujii ,  Kiyotaka Shindo

IPC: B24D3/28 ,  B24D3/344 ,  C09G1/16 ,  D21H17/375 ,  A61K47/48176

CPC classification number: C09G1/02 ,  C09K3/1409 ,  C09K3/1454 ,  H01L21/3212

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract translation: 公开了一种抛光浆料，其能够在确保足够的抛光速率的同时抑制对底层的损伤。 研磨浆料含有具有酰胺基的树脂（A）和有机树脂（B）。