Invention Grant
- Patent Title: Techniques for forming solder bump interconnects
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Application No.: US11856831Application Date: 2007-09-18
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Publication No.: US08148255B2Publication Date: 2012-04-03
- Inventor: Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel
- Applicant: Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.
Public/Granted literature
- US20090072392A1 Techniques For Forming Solder Bump Interconnects Public/Granted day:2009-03-19
Information query
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