Invention Grant
- Patent Title: Modification of solder alloy compositions to suppress interfacial void formation in solder joints
- Patent Title (中): 焊接合金组合物的改性以抑制焊点中的界面空隙形成
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Application No.: US11669076Application Date: 2007-01-30
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Publication No.: US08157158B2Publication Date: 2012-04-17
- Inventor: Peter A. Gruber , Donald W. Henderson , Sung K. Kang , Da-Yuan Shih
- Applicant: Peter A. Gruber , Donald W. Henderson , Sung K. Kang , Da-Yuan Shih
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Daniel P. Morris; David Aker
- Main IPC: B23K31/00
- IPC: B23K31/00
Abstract:
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.
Public/Granted literature
- US20080182124A1 MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS Public/Granted day:2008-07-31
Information query
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