Invention Grant
- Patent Title: Micro-fluidic injection molded solder (IMS)
- Patent Title (中): 微流体注射焊料(IMS)
-
Application No.: US13156736Application Date: 2011-06-09
-
Publication No.: US08162200B2Publication Date: 2012-04-24
- Inventor: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- Applicant: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B26D3/00 ; B29C65/64

Abstract:
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
Public/Granted literature
- US20110233262A1 Micro-Fluidic Injection Molded Solder (IMS) Public/Granted day:2011-09-29
Information query
IPC分类: