Invention Grant
- Patent Title: Particle reduction on surfaces of chemical vapor deposition processing apparatus
- Patent Title (中): 化学气相沉积处理装置表面的减少颗粒
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Application No.: US11498606Application Date: 2006-08-02
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Publication No.: US08173228B2Publication Date: 2012-05-08
- Inventor: Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
- Applicant: Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H05H1/24
- IPC: H05H1/24 ; B05D3/00 ; B05C13/00
Abstract:
A method of reducing the amount of particulates generated from the surface of a processing component used during plasma enhanced chemical vapor deposition of thin films. The body of the processing component comprises an aluminum alloy, and an exterior surface of said processing component is texturized to increase the amount of surface area present on the exterior surface. The texturizing process includes at least one step in which the surface to be texturized is bead blasted or chemically grained, so that the surface roughness of the texturized surface ranges from about 50 μ-inch Ra to about 1,000 μ-inch Ra.
Public/Granted literature
- US20070178810A1 Particle reduction on surfaces of chemical vapor deposition processing apparatus Public/Granted day:2007-08-02
Information query
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