Invention Grant
US08178983B2 Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same
失效
用于曝光的基材的防水组合物,抗蚀剂图案的形成方法,通过形成方法制造的电子装置,用于赋予待暴露的基板的拒水性的处理方法,待曝光的基板的防水组和用于赋予水的处理方法 对使用其曝光的基板的排斥性
- Patent Title: Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same
- Patent Title (中): 用于曝光的基材的防水组合物,抗蚀剂图案的形成方法,通过形成方法制造的电子装置,用于赋予待暴露的基板的拒水性的处理方法,待曝光的基板的防水组和用于赋予水的处理方法 对使用其曝光的基板的排斥性
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Application No.: US12867670Application Date: 2009-02-20
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Publication No.: US08178983B2Publication Date: 2012-05-15
- Inventor: Takeo Ishibashi , Mamoru Terai , Takuya Hagiwara , Osamu Yokokoji , Yoko Takebe
- Applicant: Takeo Ishibashi , Miwako Ishibashi, legal representative , Mamoru Terai , Takuya Hagiwara , Osamu Yokokoji , Yoko Takebe
- Applicant Address: JP Kanagawa JP Tokyo
- Assignee: Renesas Electronics Corporation,Asahi Glass Company, Limited
- Current Assignee: Renesas Electronics Corporation,Asahi Glass Company, Limited
- Current Assignee Address: JP Kanagawa JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-041716 20080222; JP2008-161541 20080620; JP2009-026327 20090206
- International Application: PCT/JP2009/053057 WO 20090220
- International Announcement: WO2009/104748 WO 20090827
- Main IPC: H01L23/29
- IPC: H01L23/29 ; B05D3/02

Abstract:
It is an object of the present invention to provide a water repellant composition for a substrate to be exposed which inhibits the back side of a substrate to be exposed from being contaminated by an immersion liquid, can improve adhesion between a film to be processed and an organic film directly overlying that film to inhibit film peeling, and has excellent workability, a method for forming a resist pattern, an electronic device produced by the formation method, a treatment method for imparting water repellency to a substrate to be exposed, a water repellent set for a substrate to be exposed, and a treatment method for imparting water repellency to a substrate to be exposed using the same. A water repellent composition for a substrate to be exposed including at least an organosilicon compound represented by the following general formula (1) and a solvent is used. In the formula, R1 is a monovalent organic group having 14 to 30 carbon atoms, each R2, R3, and R4 is independently a monovalent organic group or a hydrolyzable group having 1 to 10 carbon atoms, and at least one of R2, R3, and R4 is a hydrolyzable group.
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