Invention Grant
- Patent Title: Module structure
- Patent Title (中): 模块结构
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Application No.: US12607306Application Date: 2009-10-28
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Publication No.: US08179681B2Publication Date: 2012-05-15
- Inventor: Fumio Aoki
- Applicant: Fumio Aoki
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2008-288003 20081110
- Main IPC: H05K1/14
- IPC: H05K1/14
Abstract:
An apparatus includes a case including a surface, a bottom face and a first hole arranged on the bottom face; a first connector on the bottom face of the case; and a guide pin arranged in the first hole and being capable of moving in the first hole.
Public/Granted literature
- US20100118497A1 MODULE STRUCTURE Public/Granted day:2010-05-13
Information query
