Invention Grant
- Patent Title: Multi-chip assembly with optically coupled die
- Patent Title (中): 具有光耦合模的多芯片组装
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Application No.: US12938608Application Date: 2010-11-03
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Publication No.: US08189361B2Publication Date: 2012-05-29
- Inventor: Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
- Applicant: Qing A. Zhou , Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L31/147
- IPC: H01L31/147
Abstract:
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
Public/Granted literature
- US20110058419A1 MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE Public/Granted day:2011-03-10
Information query
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