Invention Grant
- Patent Title: Flexible circuit assemblies without solder and methods for their manufacture
- Patent Title (中): 无焊料的柔性电路组件及其制造方法
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Application No.: US12581711Application Date: 2009-10-19
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Publication No.: US08193042B2Publication Date: 2012-06-05
- Inventor: Joseph C. Fjelstad
- Applicant: Joseph C. Fjelstad
- Applicant Address: US CA Cupertino
- Assignee: Occam Portfolio LLC
- Current Assignee: Occam Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Edward P. Heller, III
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.
Public/Granted literature
- US20100096166A1 Flexible Circuit Assemblies without Solder and Methods for their Manufacture Public/Granted day:2010-04-22
Information query
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