Invention Grant
- Patent Title: Processing thin wafers
- Patent Title (中): 加工薄晶圆
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Application No.: US12485808Application Date: 2009-06-16
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Publication No.: US08206551B2Publication Date: 2012-06-26
- Inventor: Terry Bluck , Stuart Scollay , Edric Tong
- Applicant: Terry Bluck , Stuart Scollay , Edric Tong
- Applicant Address: US CA Santa Clara
- Assignee: Intevac, Inc.
- Current Assignee: Intevac, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Nixon Peabody LLP
- Agent Joseph Bach, Esq.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00
Abstract:
There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
Public/Granted literature
- US20090252582A1 PROCESSING THIN WAFERS Public/Granted day:2009-10-08
Information query
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