Invention Grant
- Patent Title: Microelectromechanical system microphone structure and microelectromechanical system microphone package structure
- Patent Title (中): 微机电系统麦克风结构和微机电系统麦克风封装结构
-
Application No.: US12211650Application Date: 2008-09-16
-
Publication No.: US08208662B2Publication Date: 2012-06-26
- Inventor: Li-Che Chen
- Applicant: Li-Che Chen
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT., P.C.
- Agent Justin King
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A microelectromechanical system microphone structure including a substrate, a first device and at least one second device is provided. The first device is disposed on the substrate and including a first upper electrode and a first lower electrode disposed between the first upper electrode and the substrate. The second device is disposed on the substrate, surrounding the first device and including a second upper electrode and a second lower electrode disposed between the second upper electrode and the substrate. The second upper electrode includes a plurality of first conductive layers and first plugs. The first conductive layers are arranged in steps, and the first plug is disposed between the adjacent first conductive layers. The second lower electrode includes a plurality of second conductive layers and a plurality of second plugs. The second conductive layers are arranged in steps, and the second plug is disposed between the adjacent second conductive layers.
Public/Granted literature
Information query