A flexible circuit electrode array and method of fabrication having a polymer base layer; metal traces deposited on the polymer base layer, including electrodes to stimulate tissue; a polymer top layer deposited on the polymer base layer and metal traces; and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer; depositing a first a base layer on the first soft polymer layer; providing a metal thin film on the base layer; depositing a top polymer layer on the metal thin film; providing holes in the top polymer layer; depositing a second soft polymer layer on the top polymer layer; providing holes in the second soft polymer layer for bond pads and electrodes; and preparing electrodes in the provided holes.