Invention Grant
- Patent Title: Method of manufacturing printed circuit board having metal bump
- Patent Title (中): 制造具有金属凸块的印刷电路板的方法
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Application No.: US12552957Application Date: 2009-09-02
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Publication No.: US08209860B2Publication Date: 2012-07-03
- Inventor: Jin Yong An , Seok Kyu Lee
- Applicant: Jin Yong An , Seok Kyu Lee
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2009-0060698 20090703
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.
Public/Granted literature
- US20110000083A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING METAL BUMP Public/Granted day:2011-01-06
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