公开(公告)号：US09021693B2

公开(公告)日：2015-05-05

申请号：US13477407

申请日：2012-05-22

Applicant: Jin Yong An ,  Jae Joon Lee

Inventor： Jin Yong An ,  Jae Joon Lee

IPC: H01K3/10 ,  H05K3/40 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H05K3/10 ,  H05K3/20

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2203/0228 ,  H05K2203/0376 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film; forming an insulation layer on the dry film; forming a build-up layer including a lower circuit layer on the insulation layer; removing the carrier; and removing the dry film.

Abstract translation: 一种制造印刷电路板的方法，包括：在载体上涂覆干膜，然后对干膜图案形成用于形成金属凸块的孔; 形成包含填充在孔中的金属凸块和干膜上的连接焊盘的上电路层; 在干膜上形成绝缘层; 在所述绝缘层上形成包括下电路层的堆积层; 移除载体; 并除去干膜。

公开(公告)号：US08209860B2

公开(公告)日：2012-07-03

申请号：US12552957

申请日：2009-09-02

Applicant: Jin Yong An ,  Seok Kyu Lee

Inventor： Jin Yong An ,  Seok Kyu Lee

IPC: H01R9/00

CPC classification number: H05K3/4007 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T428/24917

Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.

Abstract translation: 这里公开了具有均匀直径并以细间距形成的金属凸块的印刷电路板，以及制造印刷电路板的方法。

公开(公告)号：US07971352B2

公开(公告)日：2011-07-05

申请号：US12213465

申请日：2008-06-19

Applicant: Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

Inventor： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

IPC: H01R9/00 ,  H05K3/00

CPC classification number: H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

公开(公告)号：US20110018123A1

公开(公告)日：2011-01-27

申请号：US12591313

申请日：2009-11-16

Applicant: Jin Yong An ,  Chang Sup Ryu

Inventor： Jin Yong An ,  Chang Sup Ryu

IPC: H01L23/48 ,  H01L21/50 ,  H01L23/36

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. The semiconductor package may include: an insulator that has first and second opening parts; an active element that is disposed inside the first opening part; a passive element that is disposed inside the second opening part; a protective member that is disposed at a lower part of the insulator and covers a lower part of the passive element; a build-up layer that is disposed on the insulator and electrically connected to the active element; and an external connection unit that is electrically connected to the build-up layer.

Abstract translation: 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 半导体封装可以包括：具有第一和第二开口部分的绝缘体; 设置在所述第一开口部内的有源元件; 被配置在所述第二开口部内的无源元件， 保护构件，其设置在所述绝缘体的下部并且覆盖所述无源元件的下部; 堆积层，其设置在所述绝缘体上并电连接到所述有源元件; 以及电连接到积聚层的外部连接单元。

公开(公告)号：US20100139969A1

公开(公告)日：2010-06-10

申请号：US12379480

申请日：2009-02-23

Applicant: Jin Yong An ,  Ki Hwan Kim

Inventor： Jin Yong An ,  Ki Hwan Kim

IPC: H05K1/11 ,  B05D5/12 ,  H05K3/00

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H01L2224/81192 ,  H05K3/061 ,  H05K3/243 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/054 ,  H05K2203/1536

Abstract: Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer.

Abstract translation: 这里公开了一种印刷电路板，包括：具有恒定直径并在绝缘层上突出的金属凸块; 形成在绝缘层之下的电路层; 以及通过绝缘层的通孔以将金属凸块与电路层连接。

公开(公告)号：US20100139964A1

公开(公告)日：2010-06-10

申请号：US12382360

申请日：2009-03-13

Applicant: Jin Yong An ,  Jae Joon Lee

Inventor： Jin Yong An ,  Jae Joon Lee

IPC: H05K1/11 ,  B44C1/22

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2203/0228 ,  H05K2203/0376 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.

Abstract translation: 这里公开了一种印刷电路板，包括：上电路层，包括由导电金属制成的并埋在绝缘层中的连接焊盘; 和金属凸块，每个具有恒定的直径，其与连接焊盘成一体并突出在绝缘层上。

公开(公告)号：US07707715B2

公开(公告)日：2010-05-04

申请号：US12005610

申请日：2007-12-28

Applicant: Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

Inventor： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC: H05K3/00

CPC classification number: H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract translation: 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US20090151160A1

公开(公告)日：2009-06-18

申请号：US12213465

申请日：2008-06-19

Applicant: Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

Inventor： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

IPC: H05K3/10 ,  H05K3/36

CPC classification number: H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

公开(公告)号：US20090084494A1

公开(公告)日：2009-04-02

申请号：US12007475

申请日：2008-01-10

Applicant: Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

Inventor： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

IPC: B29C65/00

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0228 ,  H05K2203/0384 ,  Y10T156/1052

Abstract: A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.

Abstract translation: 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。

公开(公告)号：US07499258B2

公开(公告)日：2009-03-03

申请号：US11319722

申请日：2005-12-29

Applicant: Chang Hoon Shim ,  Jin Yong An ,  Suk Hyeon Cho ,  Sung Hyung Kang

Inventor： Chang Hoon Shim ,  Jin Yong An ,  Suk Hyeon Cho ,  Sung Hyung Kang

IPC: H01G4/236 ,  H01G4/06

CPC classification number: H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K1/185 ,  H05K2201/10643 ,  H01L2924/00

Abstract: The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor has a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.

Abstract translation: 本发明提供一种嵌入式多层片状电容器及具有该电容器的印刷电路板。 嵌入式多层片状电容器具有电容器主体，该电容器本体具有彼此层叠的多个电介质层; 多个第一和第二内部电极，形成在电容器本体内部，被电介质层分隔开; 并且第一和第二通孔在电容器体内垂直延伸。 第一通孔连接到第一内部电极，第二通孔连接到第二内部电极。 第一通孔被引导到电容器主体的底部，第二通孔被引导到电容器主体的顶部。