Invention Grant
US08211229B2 Apparatus including column having hollow part filled with filler and solid film-formation material
失效
包括具有填充有填料和固体成膜材料的中空部分的柱的装置
- Patent Title: Apparatus including column having hollow part filled with filler and solid film-formation material
- Patent Title (中): 包括具有填充有填料和固体成膜材料的中空部分的柱的装置
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Application No.: US12246519Application Date: 2008-10-07
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Publication No.: US08211229B2Publication Date: 2012-07-03
- Inventor: Hiroyuki Ode
- Applicant: Hiroyuki Ode
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2007-263249 20071009
- Main IPC: B05C11/00
- IPC: B05C11/00 ; C23C16/00
Abstract:
A solid film-formation material feeding apparatus includes a supercritical fluid supply source for supplying supercritical fluid; and a column which is connected to the supercritical fluid supply source, and has a hollow part which is filled with a filler which is inactive for the supercritical fluid, wherein the hollow part can be further filled with a solid film-formation material which is soluble in the supercritical fluid. A column assembly which includes a plurality of the columns which may be connected in parallel to each other.
Public/Granted literature
- US20090092856A1 APPARATUS FOR FEEDING SOLID FILM-FORMATION MATERIAL Public/Granted day:2009-04-09
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