Invention Grant
- Patent Title: Method for making device housing
- Patent Title (中): 制造设备外壳的方法
-
Application No.: US12622689Application Date: 2009-11-20
-
Publication No.: US08211503B2Publication Date: 2012-07-03
- Inventor: Ben-Ding Tsao , Wen-Lin Xiong , Xian-Ming Wu , Jian-Bao Han , Dian-Ming Zhu , Chong Cai
- Applicant: Ben-Ding Tsao , Wen-Lin Xiong , Xian-Ming Wu , Jian-Bao Han , Dian-Ming Zhu , Chong Cai
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910301130 20090325
- Main IPC: B05D3/12
- IPC: B05D3/12 ; B05D3/04 ; B06B1/00
Abstract:
A method for making device housing comprises: providing a transparent film; forming a coating on one surface of the film by printing ink containing metal powder on the film and ultrasonically treating the coating; and molding a substrate onto the coating.
Public/Granted literature
- US20100247802A1 METHOD FOR MAKING DEVICE HOUSING Public/Granted day:2010-09-30
Information query
