Invention Grant
- Patent Title: Method for inspecting EUV reticle and apparatus thereof
- Patent Title (中): EUV掩模版检查方法及其装置
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Application No.: US12850899Application Date: 2010-08-05
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Publication No.: US08217349B2Publication Date: 2012-07-10
- Inventor: Chiyan Kuan , Wei Fang , You-Jin Wang
- Applicant: Chiyan Kuan , Wei Fang , You-Jin Wang
- Applicant Address: TW Hsinchu
- Assignee: Hermes Microvision, Inc.
- Current Assignee: Hermes Microvision, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01J37/28
- IPC: H01J37/28 ; G01N23/00 ; G21K5/00

Abstract:
A method of inspecting an EUV reticle is proposed, which uses an electron beam (EB) with low density and high energy to scan the surface of an EUV reticle for inspecting the EUV reticle. A step of conditioning surface charge is followed by a step of inspecting surface of the EUV reticle. The step of conditioning surface can neutralize the surface charge and the step of inspecting can obtain an image of the EUV reticle. The present invention uses a scanning electron microscope (SEM) to provide a primary electron beam for conditioning the surface charge and a focused primary electron beam for scanning the surface.
Public/Granted literature
- US20120032076A1 METHOD FOR INSPECTING EUV RETICLE AND APPARATUS THEREOF Public/Granted day:2012-02-09
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