Invention Grant
US08233282B2 Frame for a device mounted above a printed circuit board in an electronic device
有权
用于安装在电子设备中印刷电路板上方的装置的框架
- Patent Title: Frame for a device mounted above a printed circuit board in an electronic device
- Patent Title (中): 用于安装在电子设备中印刷电路板上方的装置的框架
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Application No.: US12049854Application Date: 2008-03-17
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Publication No.: US08233282B2Publication Date: 2012-07-31
- Inventor: Chao Chen , Tim Kyowski , Jason Griffin
- Applicant: Chao Chen , Tim Kyowski , Jason Griffin
- Applicant Address: CA Waterloo, Ontario
- Assignee: Research in Motion Limited
- Current Assignee: Research in Motion Limited
- Current Assignee Address: CA Waterloo, Ontario
- Agency: McCarthy Tétrault LLP
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
The disclosure describes a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.
Public/Granted literature
- US20080158804A1 FRAME FOR A DEVICE MOUNTED ABOVE A PRINTED CIRCUIT BOARD IN AN ELECTRONIC DEVICE Public/Granted day:2008-07-03
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