Invention Grant
- Patent Title: Wiring board and wiring board manufacturing method
- Patent Title (中): 接线板和接线板制造方法
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Application No.: US12486000Application Date: 2009-06-17
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Publication No.: US08237057B2Publication Date: 2012-08-07
- Inventor: Takayuki Hirose , Norihito Tsukahara , Manabu Gokan
- Applicant: Takayuki Hirose , Norihito Tsukahara , Manabu Gokan
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2008-165055 20080624
- Main IPC: H05K1/09
- IPC: H05K1/09 ; B05D5/12 ; B05D3/10 ; B32B38/14

Abstract:
A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.
Public/Granted literature
- US20090314528A1 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD Public/Granted day:2009-12-24
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