Invention Grant
- Patent Title: Method and apparatus for reducing down time of a lithography system
- Patent Title (中): 降低光刻系统时间的方法和装置
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Application No.: US12486565Application Date: 2009-06-17
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Publication No.: US08237132B2Publication Date: 2012-08-07
- Inventor: Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
- Applicant: Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G21K5/00
- IPC: G21K5/00

Abstract:
An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.
Public/Granted literature
- US20100321660A1 METHOD AND APPARATUS FOR REDUCING DOWN TIME OF A LITHOGRAPHY SYSTEM Public/Granted day:2010-12-23
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