Invention Grant
- Patent Title: Circuit board testing using a probe
- Patent Title (中): 使用探头进行电路板测试
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Application No.: US12251196Application Date: 2008-10-14
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Publication No.: US08253430B2Publication Date: 2012-08-28
- Inventor: Alexander Leon
- Applicant: Alexander Leon
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company
- Current Assignee: Hewlett-Packard Development Company
- Current Assignee Address: US TX Houston
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/02
Abstract:
A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.
Public/Granted literature
- US20090058445A1 CIRCUIT BOARD TESTING USING A PROBE Public/Granted day:2009-03-05
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