Invention Grant
- Patent Title: Method of manufacturing electronic-parts package
- Patent Title (中): 制造电子零件包装的方法
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Application No.: US12547917Application Date: 2009-08-26
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Publication No.: US08256107B2Publication Date: 2012-09-04
- Inventor: Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
- Applicant: Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2008-218427 20080827
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.
Public/Granted literature
- US20100053918A1 ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2010-03-04
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