Invention Grant
US08256107B2 Method of manufacturing electronic-parts package 有权
制造电子零件包装的方法

Method of manufacturing electronic-parts package
Abstract:
An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.
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