Invention Grant
- Patent Title: Pattern forming method and its mold
- Patent Title (中): 图案成型方法及其模具
-
Application No.: US11623776Application Date: 2007-01-17
-
Publication No.: US08268209B2Publication Date: 2012-09-18
- Inventor: Masahiko Ogino , Akihiro Miyauchi , Takashi Ando , Chiseki Haginoya , Susumu Komoriya , Yasunari Sohda , Souichi Katagiri , Hiroya Ohta , Yoshinori Nakayama
- Applicant: Masahiko Ogino , Akihiro Miyauchi , Takashi Ando , Chiseki Haginoya , Susumu Komoriya , Yasunari Sohda , Souichi Katagiri , Hiroya Ohta , Yoshinori Nakayama
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-009369 20060118
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
In a mold in which a pattern is formed of a fine concavo-convex shape, two or more of alignment marks for determining a relative positional relation between a substrate and a mold are formed concentrically. Moreover, a damaged mark is identified from the positional information and shape of the respective marks, and an alignment between the mold and the substrate to which a resin film is applied is carried out excluding the damaged mark.
Public/Granted literature
- US20070164458A1 PATTERN FORMING METHOD AND ITS MOLD Public/Granted day:2007-07-19
Information query
IPC分类:
