Invention Grant
US08268662B2 Fabricating method of complementary metal-oxide-semiconductor (CMOS) image sensor 有权
互补金属氧化物半导体(CMOS)图像传感器的制造方法

  • Patent Title: Fabricating method of complementary metal-oxide-semiconductor (CMOS) image sensor
  • Patent Title (中): 互补金属氧化物半导体(CMOS)图像传感器的制造方法
  • Application No.: US13026302
    Application Date: 2011-02-14
  • Publication No.: US08268662B2
    Publication Date: 2012-09-18
  • Inventor: Ching-Hung Kao
  • Applicant: Ching-Hung Kao
  • Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
  • Assignee: United Microelectronics Corp.
  • Current Assignee: United Microelectronics Corp.
  • Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
  • Agent Winston Hsu; Scott Margo
  • Main IPC: H01L31/0216
  • IPC: H01L31/0216
Fabricating method of complementary metal-oxide-semiconductor (CMOS) image sensor
Abstract:
A method of fabricating a complementary metal-oxide-semiconductor (CMOS) image sensor is provided. First, an isolation structure is formed in a substrate with a photo-sensitive region and a transistor device region in the substrate. The transistor device region includes at least a region for forming a transfer transistor. A dielectric layer and a conductive layer are sequentially formed on the substrate. An ion implantation process is performed to implant a dopant into the substrate below the position for forming a gate of the transfer transistor and in the photo-sensitive region through the conductive layer and the dielectric layer. The conductive layer and the dielectric layer are patterned to at least form the gate structure of the transfer transistor on the transistor device region. Thereafter, a photo diode is formed in the substrate in the photo-sensitive region.
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