Invention Grant
- Patent Title: Electronic component, mounting structure thereof, and method for mounting electronic component
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Application No.: US13329791Application Date: 2011-12-19
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Publication No.: US08274201B2Publication Date: 2012-09-25
- Inventor: Nobuaki Hashimoto
- Applicant: Nobuaki Hashimoto
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2007-272532 20071019; JP2008-036715 20080218
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.
Public/Granted literature
- US20120091860A1 ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT Public/Granted day:2012-04-19
Information query
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