Invention Grant
- Patent Title: Method for producing thermoelectric material
- Patent Title (中): 热电材料的制造方法
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Application No.: US12845779Application Date: 2010-07-29
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Publication No.: US08277904B2Publication Date: 2012-10-02
- Inventor: Wei-Sheng Su , Chia-Hung Kuo , Ya-Wen Chou , Jie-Ren Ku , Ming-Shan Jeng , Chii-Shyang Hwang , Zong-Hao Wu
- Applicant: Wei-Sheng Su , Chia-Hung Kuo , Ya-Wen Chou , Jie-Ren Ku , Ming-Shan Jeng , Chii-Shyang Hwang , Zong-Hao Wu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99106968A 20100310
- Main IPC: B27C71/02
- IPC: B27C71/02 ; B05D3/10 ; B05D1/18
Abstract:
A method for producing a thermoelectric material is provided. A semiconductor material powder is provided. An electroless plating process is preformed to deposit metal nano-particles on the surface of semiconductor material powder. An electrical current activated sintering process is performed to form a thermoelectric material having one and plurality grain boundaries.
Public/Granted literature
- US20110223350A1 METHOD FOR PRODUCING THERMOELECTRIC MATERIAL Public/Granted day:2011-09-15
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