Invention Grant
- Patent Title: Electronic device enclosure with anti-EMI holes
- Patent Title (中): 具防电磁孔的电子设备外壳
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Application No.: US12909044Application Date: 2010-10-21
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Publication No.: US08279600B2Publication Date: 2012-10-02
- Inventor: Yu-Hsu Lin
- Applicant: Yu-Hsu Lin
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010200942 20100615
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00

Abstract:
An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the first plane. The angle of orientation of the number of polygonal holes in the first plate is set according to a number of maximum dimensions in a direction substantially perpendicular to the second plane. The angle of orientation is defined such that there are a minimum number of maximum dimensions.
Public/Granted literature
- US20110304977A1 ELECTRONIC DEVICE ENCLOSURE WITH ANTI-EMI HOLES Public/Granted day:2011-12-15
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