A microelectromechanical system diaphragm is provided. The microelectromechanical system diaphragm includes a substrate, a first conductive layer, a second conductive layer, a first dielectric layer, and a second dielectric layer. The first conductive layer is disposed on the substrate. The first conductive layer has a flexible portion in which a plurality of trenches is formed. The second conductive layer is disposed between the first conductive layer and the substrate, in which the flexible portion is located above the second conductive layer. The first dielectric layer is disposed between the second conductive layer and the substrate. The second dielectric layer is disposed between the substrate and a portion of the first conductive layer so as to suspend the flexible portion. Furthermore, at least one first opening is formed in the first conductive layer.