Invention Grant
- Patent Title: Apparatus and method for providing cooling to multiple components
- Patent Title (中): 用于向多个部件提供冷却的装置和方法
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Application No.: US12137436Application Date: 2008-06-11
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Publication No.: US08280559B2Publication Date: 2012-10-02
- Inventor: Jeffrey Herman , Sagheer Ahmad
- Applicant: Jeffrey Herman , Sagheer Ahmad
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G05D23/00
- IPC: G05D23/00
Abstract:
In an embodiment, an integrated circuit includes an input configured to receive a first control signal and an output module configured to generate an output signal based at least on the first control signal and a second control signal generated based at least on a measured temperature of the IC. The output signal is configured to control a cooling device.
Public/Granted literature
- US20090312874A1 Apparatus and Method for Providing Cooling to Multiple Components Public/Granted day:2009-12-17
Information query
