Invention Grant
US08288778B2 Semiconductor device having semiconductor elements formed inside a resin film substrate 有权
具有形成在树脂膜基板内的半导体元件的半导体装置

Semiconductor device having semiconductor elements formed inside a resin film substrate
Abstract:
A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, an organic semiconductor disposed inside the through hole, an insulating film on one end of the organic semiconductor, a gate electrode on the insulating film, a source electrode connected electrically to the other end of the organic semiconductor and a drain electrode connected electrically to the other end of the organic semiconductor.
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