Invention Grant
- Patent Title: Metal gate structure of a semiconductor device
- Patent Title (中): 半导体器件的金属栅极结构
-
Application No.: US12754761Application Date: 2010-04-06
-
Publication No.: US08294202B2Publication Date: 2012-10-23
- Inventor: Shiu-Ko Jangjian , Szu-An Wu , Sheng-Wen Chen
- Applicant: Shiu-Ko Jangjian , Szu-An Wu , Sheng-Wen Chen
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A semiconductor device structure, for improving the metal gate leakage within the semiconductor device. A structure for a metal gate electrode for a n-type Field Effect Transistor includes a capping layer; a first metal layer comprising Ti and Al over the capping layer; a metal oxide layer over the first metal layer; a barrier layer over the metal oxide layer; and a second metal layer over the barrier layer.
Public/Granted literature
- US20110006354A1 METAL GATE STRUCTURE OF A SEMICONDUCTOR DEVICE Public/Granted day:2011-01-13
Information query
IPC分类: