Invention Grant
- Patent Title: Method for connecting two joining surfaces
- Patent Title (中): 连接两个连接表面的方法
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Application No.: US12742176Application Date: 2008-11-14
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Publication No.: US08299613B2Publication Date: 2012-10-30
- Inventor: Hermann Oppermann
- Applicant: Hermann Oppermann
- Applicant Address: DE
- Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.
- Current Assignee Address: DE
- Agency: Altera Law Group, LLC
- Priority: DE102007055017 20071114
- International Application: PCT/EP2008/009834 WO 20081114
- International Announcement: WO2009/062757 WO 20090522
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.
Public/Granted literature
- US20100270673A1 METHOD FOR CONNECTING TWO JOINING SURFACES Public/Granted day:2010-10-28
Information query
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