An apparatus for use when applying a compound from a dispensing tube comprises: a receptacle; a plurality of retaining rings mechanically coupled to the receptacle for attaching the apparatus to the dispensing tube; an application blade secured within the receptacle for contacting the compound being dispensed during application; optionally, a handle mechanically coupled on an opposite side of the receptacle from the plurality of retaining rings; and, optionally, at least one retaining clip for securing at least one of the plurality of retaining rings around a nozzle tip of the dispensing tube. Such apparatus and related methods facilitate initial application of the compound in an evenly distributed and desired topographical manner without requiring subsequent smoothing and/or shaping steps after contact of the compound with a surface to which it is applied.